JPH0361965B2 - - Google Patents

Info

Publication number

JPH0361965B2

JPH0361965B2 JP58213356A JP21335683A JPH0361965B2 JP H0361965 B2 JPH0361965 B2 JP H0361965B2 JP 58213356 A JP58213356 A JP 58213356A JP 21335683 A JP21335683 A JP 21335683A JP H0361965 B2 JPH0361965 B2 JP H0361965B2

Authority

JP

Japan

Prior art keywords

melting point

weight

low melting

wire

silicone resin

Prior art date

1983-11-15

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired - Lifetime

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• 238000002844 melting Methods 0.000 claims description 30
• 230000008018 melting Effects 0.000 claims description 30
• 239000000843 powder Substances 0.000 claims description 24
• 239000000203 mixture Substances 0.000 claims description 23
• 229920002050 silicone resin Polymers 0.000 claims description 17
• PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 14
• 239000001023 inorganic pigment Substances 0.000 claims description 14
• 229910052582 BN Inorganic materials 0.000 claims description 13
• 239000007788 liquid Substances 0.000 claims description 9
• 238000000354 decomposition reaction Methods 0.000 claims description 6
• 239000003960 organic solvent Substances 0.000 claims description 4
• 239000008199 coating composition Substances 0.000 claims description 3
• 239000000463 material Substances 0.000 description 27
• 239000011248 coating agent Substances 0.000 description 19
• 238000000576 coating method Methods 0.000 description 19
• UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 12
• YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
• 239000002245 particle Substances 0.000 description 11
• 239000002904 solvent Substances 0.000 description 9
• 230000007423 decrease Effects 0.000 description 6
• 238000000034 method Methods 0.000 description 5
• 229910004298 SiO 2 Inorganic materials 0.000 description 4
• 230000000052 comparative effect Effects 0.000 description 4
• 238000005336 cracking Methods 0.000 description 4
• 238000009413 insulation Methods 0.000 description 4
• 239000003973 paint Substances 0.000 description 4
• 239000011521 glass Substances 0.000 description 3
• 238000002156 mixing Methods 0.000 description 3
• 238000007747 plating Methods 0.000 description 3
• 229920005989 resin Polymers 0.000 description 3
• 239000011347 resin Substances 0.000 description 3
• 238000005979 thermal decomposition reaction Methods 0.000 description 3
• 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
• 238000001816 cooling Methods 0.000 description 2
• 238000010292 electrical insulation Methods 0.000 description 2
• 229920000592 inorganic polymer Polymers 0.000 description 2
• XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
• 239000011344 liquid material Substances 0.000 description 2
• 239000000049 pigment Substances 0.000 description 2
• 229920001296 polysiloxane Polymers 0.000 description 2
• 238000004804 winding Methods 0.000 description 2
• 229920000178 Acrylic resin Polymers 0.000 description 1
• 239000004925 Acrylic resin Substances 0.000 description 1
• VCUFZILGIRCDQQ-KRWDZBQOSA-N N-[[(5S)-2-oxo-3-(2-oxo-3H-1,3-benzoxazol-6-yl)-1,3-oxazolidin-5-yl]methyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C1O[C@H](CN1C1=CC2=C(NC(O2)=O)C=C1)CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F VCUFZILGIRCDQQ-KRWDZBQOSA-N 0.000 description 1
• CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
• 239000004962 Polyamide-imide Substances 0.000 description 1
• 239000004642 Polyimide Substances 0.000 description 1
• MZZSDCJQCLYLLL-UHFFFAOYSA-N Secalonsaeure A Natural products COC(=O)C12OC3C(CC1=C(O)CC(C)C2O)C(=CC=C3c4ccc(O)c5C(=O)C6=C(O)CC(C)C(O)C6(Oc45)C(=O)OC)O MZZSDCJQCLYLLL-UHFFFAOYSA-N 0.000 description 1
• GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
• TZHYBRCGYCPGBQ-UHFFFAOYSA-N [B].[N] Chemical compound [B].[N] TZHYBRCGYCPGBQ-UHFFFAOYSA-N 0.000 description 1
• -1 alkyl resins, acrylic Chemical compound 0.000 description 1
• 239000011230 binding agent Substances 0.000 description 1
• 230000015556 catabolic process Effects 0.000 description 1
• 239000011247 coating layer Substances 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 239000003822 epoxy resin Substances 0.000 description 1
• 239000007789 gas Substances 0.000 description 1
• LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
• 229920006015 heat resistant resin Polymers 0.000 description 1
• 238000010438 heat treatment Methods 0.000 description 1
• 239000012535 impurity Substances 0.000 description 1
• 238000004519 manufacturing process Methods 0.000 description 1
• 229920001568 phenolic resin Polymers 0.000 description 1
• 239000005011 phenolic resin Substances 0.000 description 1
• 230000000704 physical effect Effects 0.000 description 1
• 229920002312 polyamide-imide Polymers 0.000 description 1
• 229920000647 polyepoxide Polymers 0.000 description 1
• 229920001721 polyimide Polymers 0.000 description 1
• 229920000642 polymer Polymers 0.000 description 1
• 230000009257 reactivity Effects 0.000 description 1
• 230000035939 shock Effects 0.000 description 1
• OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
• 239000008096 xylene Substances 0.000 description 1